PCBA焊接前需要做(zuo)的準備工(gong)作(zuo)
- 發(fa)表時間(jian):2022-04-14 08:58:01
- 來源(yuan):本站
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PCBA的焊接涉及(ji)到(dao)許(xu)多PCBA加工(gong)的環(huan)節(jie),並(bing)且PCBA焊接的品質與這(zhe)些環(huan)節(jie)都是(shi)緊密相關的,壹(yi)家(jia)電(dian)子(zi)加工(gong)廠(chang)想(xiang)為客(ke)戶(hu)帶來優(you)質的服務(wu)就(jiu)必(bi)需(xu)做(zuo)好(hao)各(ge)個環(huan)節(jie),今(jin)天深(shen)圳(zhen)市潤澤五洲(zhou)為大(da)家(jia)介(jie)紹(shao)PCBA焊(han)接前需要做(zuo)的準備工(gong)作(zuo)。

PCBA波峰(feng)焊焊接前要做(zuo)哪些(xie)準備?
壹(yi)、用密度(du)計(ji)測(ce)量(liang)助(zhu)焊劑(ji)的密度(du),用稀釋劑(ji)稀釋密度(du)較大(da)的助焊劑(ji)
二、插(cha)孔被焊(han)料堵(du)塞。為(wei)了避免(mian)波峰(feng)焊時的焊錫流入(ru)PCB的上(shang)表面,建(jian)議用(yong)耐高溫(wen)膠帶貼住較大(da)尺寸(cun)的槽(cao)和(he)孔
三、如(ru)果采(cai)用傳統(tong)發泡型(xing)助焊(han)劑(ji),將助焊(han)劑(ji)倒(dao)入助(zhu)焊劑(ji)槽(cao)
上(shang)面三(san)步是(shi)波峰(feng)焊焊接前需要做(zuo)的準備工(gong)作(zuo),也(ye)是(shi)SMT貼片(pian)加工(gong)廠(chang)工(gong)藝(yi)管控(kong)中(zhong)的壹(yi)個環(huan)節(jie),潤澤五洲(zhou)電(dian)子(zi)是(shi)壹(yi)家(jia)專(zhuan)業(ye)的PCBA制造(zao)加工(gong)廠(chang),為您全程開(kai)放生(sheng)產(chan)和質量(liang)檢(jian)測(ce)過(guo)程,找(zhao)到(dao)我(wo)們,您就(jiu)屬(shu)於(yu)有了自己(ji)的電(dian)子(zi)加工(gong)廠(chang)!
以(yi)上(shang)是(shi)關於“PCBA焊接前需要做(zuo)的準備工(gong)作(zuo)”的介紹,希(xi)望(wang)對(dui)大(da)家(jia)有壹(yi)定(ding)的幫助,更多PCBA資(zi)訊請訪(fang)問:https://www.run-five.com/
【上(shang)壹(yi)篇:】PCBA快(kuai)速打樣(yang)的收費(fei)標(biao)準
【下壹(yi)篇:】談談SMT貼片(pian)檢(jian)驗(yan)的標(biao)準
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- 8無(wu)鉛焊(han)點(dian)在(zai)嚴(yan)苛(ke)環(huan)境下的裂(lie)紋(wen)失效(xiao)機(ji)理與工(gong)藝(yi)改(gai)善方(fang)案(an)咨(zi)詢(xun)
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