SMT代工(gong)向(xiang)PCBA包(bao)工(gong)包(bao)料(liao)轉(zhuan)型(xing)的難(nan)點(dian)有(you)哪些(xie)?
- 發(fa)表時間:2022-08-17 11:01:53
- 來源:本(ben)站
- 人氣(qi):537
由(you)於疫(yi)情(qing)給市(shi)場帶來了(le)很(hen)大的影(ying)響,使(shi)得許(xu)許(xu)多多(duo)的SMT加工(gong)廠(chang)開(kai)始另(ling)謀(mou)出(chu)路,有(you)些企(qi)業(ye)向(xiang)PCBA包(bao)工(gong)包(bao)料(liao)轉(zhuan)型(xing),下(xia)面(mian)讓(rang)深圳(zhen)市(shi)潤(run)澤五洲(zhou)電(dian)子科技有(you)限公(gong)司來(lai)為介紹(shao)SMT代工(gong)向(xiang)PCBA包(bao)工(gong)包(bao)料(liao)轉(zhuan)型(xing)的難(nan)點(dian)有(you)哪些(xie)?

1、供(gong)應(ying)鏈的(de)建立與管理(li)
建(jian)立優質(zhi)的供(gong)應(ying)鏈絕非(fei)壹(yi)朝(chao)壹(yi)夕所能完成,很(hen)多SMT工(gong)廠(chang)在(zai)轉型的(de)時候(hou)缺(que)乏有(you)力的(de)元(yuan)器件供應(ying)商(shang)支持,使(shi)得代工(gong)代(dai)料(liao)的(de)模(mo)式(shi)舉(ju)步維(wei)艱。
2、技(ji)術(shu)支持上的瓶(ping)頸
SMT加工(gong)通常只需(xu)負責焊接(jie)售後(hou),PCBA加工(gong)需(xu)要整(zheng)塊PCBA電(dian)路板的技術(shu)與售後(hou),這(zhe)些(xie)需(xu)要專(zhuan)業(ye)的(de)電(dian)子工(gong)程師團隊才能夠(gou)完成。
3、制(zhi)造(zao)成本(ben)大幅上升
為了(le)做好(hao)PCBA加工(gong)企(qi)業(ye)勢必(bi)要配(pei)備(bei)IQC來(lai)料(liao)檢(jian)驗(yan)、IPQC中(zhong)檢(jian)、OBA出(chu)廠(chang)檢(jian)驗(yan),需(xu)要配(pei)備(bei)更(geng)多(duo)優秀(xiu)的(de)技術(shu)型人(ren)才,才(cai)能確(que)保產(chan)品的質(zhi)量可靠(kao)性與交(jiao)付日(ri)期(qi),隨(sui)著(zhe)成本(ben)的上升,需(xu)要更(geng)多(duo)的PCBA加工(gong)訂(ding)單(dan)才(cai)能維(wei)持企業(ye)的(de)運(yun)轉(zhuan)。
4、經營風險急劇(ju)上升
由(you)於PCBA板由(you)眾多(duo)電(dian)子元(yuan)器(qi)件(jian)構(gou)成,其中(zhong)任(ren)何壹(yi)顆元(yuan)器件出(chu)了(le)品質(zhi)事故(gu),將(jiang)勢必(bi)造(zao)成整批(pi)的(de)產(chan)品不良,這(zhe)給企(qi)業(ye)的(de)售(shou)後(hou)成本(ben)以及回(hui)款(kuan)造(zao)成很(hen)大的壓力,集中(zhong)爆發(fa)時可能將(jiang)企(qi)業(ye)拉(la)入倒(dao)閉(bi)的漩渦當(dang)中(zhong)。
SMT加工(gong)廠(chang)需(xu)要從(cong)競(jing)爭(zheng)差(cha)異(yi)化(hua)、市(shi)場差異(yi)化(hua),深(shen)耕(geng)內部(bu)的制(zhi)程流程,提升客戶(hu)體驗(yan)等(deng)方(fang)面(mian)入手,而非(fei)直接(jie)轉換(huan)為為PCBA包(bao)工(gong)包(bao)料(liao)模(mo)式(shi)。
以上是關(guan)於“SMT代工(gong)向(xiang)PCBA包(bao)工(gong)包(bao)料(liao)轉(zhuan)型(xing)的難(nan)點(dian)有(you)哪些(xie)”的(de)介紹(shao),希望(wang)對(dui)大家(jia)有(you)壹(yi)定的幫(bang)助(zhu),更多PCBA資(zi)訊(xun)請關(guan)註本(ben)站的內容(rong)更新!深圳(zhen)市(shi)潤(run)澤五洲(zhou)電(dian)子科技有(you)限公(gong)司是(shi)壹(yi)家(jia)專(zhuan)業(ye)的(de)PCBA加工(gong)企(qi)業(ye),擁(yong)有(you)全自(zi)動(dong)SMT生(sheng)產(chan)線和(he)波(bo)峰焊,為您(nin)全程開放生產(chan)和質(zhi)量檢測過程,找到我(wo)們,您(nin)就(jiu)屬(shu)於有(you)了(le)自(zi)己的電(dian)子加工(gong)廠(chang)!
- 2025-02-20深圳(zhen)SMT貼(tie)片(pian)加工(gong)如何(he)計算報(bao)價?
- 2025-12-31如何(he)科學評估與投資(zi)PCBA智(zhi)能工(gong)廠(chang)?ROI測算與關(guan)鍵自(zi)動(dong)化(hua)設備(bei)選(xuan)型指(zhi)南(nan)
- 2025-12-30元(yuan)器件國(guo)產(chan)化(hua)替(ti)代進(jin)入深水區(qu),在(zai)PCBA加工(gong)中(zhong)如何(he)進(jin)行(xing)系統(tong)性的驗(yan)證(zheng)與導入?
- 2025-12-30經濟(ji)周期(qi)中(zhong),PCBA加工(gong)企(qi)業(ye)如何(he)通過產(chan)品與客戶(hu)結(jie)構調整實(shi)現逆勢增(zeng)長?
- 2025-12-26PCBA來料(liao)質(zhi)量風險轉(zhuan)移,JDM模(mo)式(shi)與傳統(tong)代工(gong)模(mo)式(shi)的責任(ren)邊(bian)界(jie)如何(he)界定?
- 2025-12-26PCBA加工(gong)企(qi)業(ye)的(de)技(ji)術(shu)護城(cheng)河(he)是什(shen)麽(me)?是工(gong)藝專(zhuan)利(li)、設備(bei)集群還(hai)是供(gong)應(ying)鏈生(sheng)態(tai)?
- 2025-12-26PCBA加工(gong)未(wei)來(lai)五年趨勢:從(cong)傳統(tong)組(zu)裝(zhuang)到系統(tong)級封裝(zhuang)(SiP)的(de)技術(shu)躍遷(qian)
- 2025-12-26無(wu)鉛焊點(dian)在嚴(yan)苛環(huan)境下(xia)的裂(lie)紋失(shi)效機理(li)與工(gong)藝改善方(fang)案(an)咨(zi)詢(xun)
- 2025-03-11AI智(zhi)能硬(ying)件(jian)的(de)趨(qu)勢是(shi)什(shen)麽(me)?
- 2025-03-11要做好(hao)SMT貼片(pian)加工(gong)需(xu)要註意哪(na)幾(ji)點(dian)?
- 1深圳(zhen)SMT貼(tie)片(pian)加工(gong)如何(he)計算報(bao)價?
- 2如何(he)科學評估與投資(zi)PCBA智(zhi)能工(gong)廠(chang)?ROI測算與關(guan)鍵自(zi)動(dong)化(hua)設備(bei)選(xuan)型指(zhi)南(nan)
- 3元(yuan)器件國(guo)產(chan)化(hua)替(ti)代進(jin)入深水區(qu),在(zai)PCBA加工(gong)中(zhong)如何(he)進(jin)行(xing)系統(tong)性的驗(yan)證(zheng)與導入?
- 4經濟(ji)周期(qi)中(zhong),PCBA加工(gong)企(qi)業(ye)如何(he)通過產(chan)品與客戶(hu)結(jie)構調整實(shi)現逆勢增(zeng)長?
- 5PCBA來料(liao)質(zhi)量風險轉(zhuan)移,JDM模(mo)式(shi)與傳統(tong)代工(gong)模(mo)式(shi)的責任(ren)邊(bian)界(jie)如何(he)界定?
- 6PCBA加工(gong)企(qi)業(ye)的(de)技(ji)術(shu)護城(cheng)河(he)是什(shen)麽(me)?是工(gong)藝專(zhuan)利(li)、設備(bei)集群還(hai)是供(gong)應(ying)鏈生(sheng)態(tai)?
- 7PCBA加工(gong)未(wei)來(lai)五年趨勢:從(cong)傳統(tong)組(zu)裝(zhuang)到系統(tong)級封裝(zhuang)(SiP)的(de)技術(shu)躍遷(qian)
- 8無(wu)鉛焊點(dian)在嚴(yan)苛環(huan)境下(xia)的裂(lie)紋失(shi)效機理(li)與工(gong)藝改善方(fang)案(an)咨(zi)詢(xun)
- 9AI智(zhi)能硬(ying)件(jian)的(de)趨(qu)勢是(shi)什(shen)麽(me)?
- 10要做好(hao)SMT貼片(pian)加工(gong)需(xu)要註意哪(na)幾(ji)點(dian)?




